TAC-3000 邊緣AI平臺
遠控治理
情況管控
遠程訪問運維和技術
安全的操作
遠控治理
情況管控
遠程訪問運維和技術
安全的操作
聯系我們產品描述
阿普奇邊界AI平臺TAC-3000是一款更適用于邊緣計算領域的嵌入式工控機，具備強大的計算能力和豐富的功能特點。嵌入式工控機TAC-3000采用高性能AI控制器，算力高達100TOPS，可快速處理復雜的AI算法和大量數據，確保邊緣計算的效率和準確性。支持NVIDIA Jetson TMS O-DIMM連接器核心板，提供高性能AI計算單元，滿足各種邊緣計算應用需求。嵌入式工控機TAC-3000還具有豐富的擴展接口，包括3個千兆網絡接口、4個USB 3.0接口以及可選的16位DIO和2個RS232/RS485 COM接口，適應各種不同的邊緣計算應用需求。支持5G/4G/WiFi功能擴展，具備強大的無線通信能力，實現高速數據交互。同時運用無散熱風扇超緊身設定，全輕金屬的強度外殼，兼容手機桌面式和DIN安裝方式，方便部署和使用。提供穩定的DC 12~28V寬壓輸入，確保在各種工作條件下穩定運行，滿足高負載邊緣計算場景需求。
總而言之，阿普奇放到式工業自動化機TAC-3000單憑雄厚的估算工作能力素質、極為豐富的括展插孔、維持的電源適配器銷售、雄厚的wifi手機網絡通信工作能力素質及協調性的布署策略等特性，符合當今非核心估算利用軟件業務需求。不適在多種非核心估算3d場景，促進推動非核心估算技術設備的成長 和利用軟件。|
Model |
TAC-3000 |
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Processor System |
SOM |
Nano |
TX2 NX |
Xavier NX |
Xavier NX 16GB |
|
AI Performance |
472 GFLOPS |
1.33 TFLOPS |
21 TOPS |
||
|
GPU |
128-core NVIDIA Maxwell??architecture GPU |
256-core NVIDIA Pascal??architecture GPU |
384-core NVIDIA Volta??architecture GPU with 48 Tensor Cores |
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|
GPU Max Frequency |
921MHz |
1.3 GHz |
1100 MHz |
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|
CPU |
Quad-core?ARM??Cortex?-A57?MPCore processor |
Dual-core?NVIDIA DenverTM?2?64-bit?CPU?and?quad-core?Arm??Cortex?-A57 MPCore processor |
6-core NVIDIA Carmel Arm? v8.2 64-bit CPU 6MB L2 + 4MB L3 |
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|
CPU Max Frequency |
1.43GHz |
Denver 2: 2 GHz Cortex-A57: 2 GHz |
1.9 GHz |
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|
Memory |
4GB?64-bit?LPDDR4 25.6GB/s |
4GB?128-bit?LPDDR4 51.2GB/s |
8GB?128-bit? LPDDR4x 59.7GB/s |
16GB?128-bit?LPDDR4x 59.7GB/s |
|
|
TDP |
5W-10W |
7.5W - 15W |
10W - 20W |
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|
Processor System |
SOM |
Orin Nano 4GB |
Orin Nano 8GB |
Orin NX 8GB |
Orin NX 16GB |
|
AI Performance |
20 TOPS |
40 TOPS |
70 TOPS |
100 TOPS |
|
|
GPU |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU? with 32 Tensor Cores |
1024-core NVIDIA Ampere? architecture GPU ?with 32 Tensor Cores |
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|
GPU Max Frequency |
625 MHz |
765 MHz |
918 MHz |
? |
|
|
CPU |
6-core Arm??Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm?? Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
8-core Arm?? Cortex?? A78AE v8.2 64-bit CPU?2MB L2 + 4MB L3 |
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|
CPU Max Frequency |
1.5 GHz |
2 GHz |
|||
|
Memory |
4GB 64-bit LPDDR5 34 GB/s |
8GB 128-bit LPDDR5 68 GB/s |
8GB 128-bit LPDDR5 102.4 GB/s |
16GB 128-bit LPDDR5 102.4 GB/s |
|
|
TDP |
7W - 10W |
7W - 15W |
10W - 20W |
10W - 25W |
|
|
Ethernet |
Controller |
1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps2 * Intel??I210-AT, 10/100/1000 Mbps | |||
|
Storage |
eMMC |
16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
|
M.2 |
1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
|
TF Slot |
1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
|
Expansion Slots |
Mini PCIe |
1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
|
M.2 |
1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
|
Front I/O |
Ethernet |
2 * RJ45 | |||
|
USB |
4 * USB3.0 (Type-A) | ||||
|
Display |
1 * HDMI: Resolution up to 4K @ 60Hz | ||||
|
Button |
1 * Power Button + Power LED 1 * System Reset Button |
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Side I/O |
USB |
1 * USB 2.0 (Micro USB, OTG) | |||
|
Button |
1 * Recovery Button | ||||
|
Antenna |
4 * Antenna hole | ||||
|
SIM |
2 * Nano SIM | ||||
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Internal I/O |
Serial |
2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
|
PWRBT |
1 * Power Button (wafer) | ||||
|
PWRLED |
1 * Power LED (wafer) | ||||
|
Audio |
1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) | ||||
|
GPIO |
1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
|
CAN Bus |
1 * CAN (wafer) | ||||
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FAN |
1 * CPU FAN (wafer) | ||||
|
Power Supply |
Type |
DC, AT | |||
|
Power Input Voltage |
12~28V DC | ||||
|
Connector |
Terminal block, 2Pin, P=5.00/5.08 | ||||
|
RTC Battery |
CR2032 Coin Cell | ||||
|
OS Support |
Linux |
Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
|
Mechanical |
Enclosure Material |
Radiator: Aluminum alloy, Box: SGCC | |||
|
Dimensions |
150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
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Mounting |
Desktop、DIN-rail | ||||
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Environment |
Heat Dissipation System |
Fan less design | |||
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Operating Temperature |
-20~60℃?with 0.7 m/s airflow | ||||
|
Storage Temperature |
-40~80℃ | ||||
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Relative Humidity |
10 to 95% (non-condensing) | ||||
|
Vibration |
3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
|
Shock |
10G, half sine, 11ms (IEC 60068-2-27) | ||||
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TAC-3000 邊緣AI平臺
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