E7S系列Q170平臺 嵌入式工控機/BOX
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qq遠程治理
情況下監控設備
即遠程基站維護
安全衛生把握
聯系我們產品描述
阿普奇嵌到式工業自動化機E7S系列Q170平臺是一款專為工業自動化和邊緣計算應用而設計的強大嵌入式工業計算機。應用Intel 6-9代Core/Pentium/Celeron處理器，TDP 65W，LGA1151封裝，確保高效性能與穩定運行。搭配Intel Q170芯片組，提供穩健的硬件平臺。2個千兆網絡接口確保高速穩定的網絡連接。2個DDR4 SO-DIMM插槽，最大支持64GB內存，滿足大量數據與復雜計算需求。4個DB9串口，支持RS232/RS422/RS485協議，便于與外部設備通信。4路顯示輸出，包括VGA、DVI-D、DP和內部LVDS/eDP，最高支持4K@60Hz分辨率。無線功能擴展支持4G/5G/WIFI/BT。MXM、aDoor模塊擴展支持滿足定制需求。PCIe/PCI擴展槽位可選。9-36V直流供電，確保各種工作條件下的穩定運行。PWM智能風扇主動散熱設計，確保系統在高負載下的穩定運行。
總的來說，阿普奇E7S系列作品Q170軟件平臺嵌入式工控機為工業自動化和邊緣計算提供強大支持，被廣泛應用在工廠和機器自動化場景，無風扇/有風扇的靈活選型及結構加固設計確保這些系統能夠承受惡劣工業環境的要求。
|
Model |
E7S |
E7DS |
E7QS |
|
|
CPU |
CPU | Intel??6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU | ||
| TDP | 65W | |||
| Socket | LGA1151 | |||
|
Chipset |
Chipset | Q170 | ||
|
BIOS |
BIOS | AMI UEFI BIOS (Support Watchdog Timer) | ||
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2133MHz | ||
| Max Capacity | 64GB, Single Max. 32GB | |||
|
Graphics |
Controller | Intel??HD Graphics | ||
|
Ethernet |
Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
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|
Storage |
SATA | 1 * SATA3.0, Quick release 2.5" hard disk bays (T≤7mm) 1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional) Support RAID 0, 1 |
||
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | |||
|
Expansin Slots |
PCIe/PCI | N/A | ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) ②: 1 * PCIe x16 + 1 * PCI ③: 2 * PCI PS: ①、②、③?One out of three, Expansion card length ≤ 185mm, TDP ≤ 130W |
①: 2 * PCIe x16 (x8/x8) + 2 * PCI
②:1?* PCIe x16 (x16) + 1 * PCIe x4 (x4) PS: ①、②?One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
| MXM/aDoor | 1 * APQ MXM ?(Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | |||
| Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, with 1 * SIM Card) | |||
| M.2 | 1 * M.2 Key-B (PCIe x1 Gen 2 + USB3.0, with 1 * SIM Card, 3052) | |||
|
Front I/O |
Ethernet | 2 * RJ45 | ||
| USB | 6 * USB3.0 (Type-A, 5Gbps) | |||
| Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz 1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
|||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |||
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) |
|||
| Button | 1 * Power Button + Power LED 1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
|||
|
Rear I/O |
Antenna | 4 * Antenna hole | ||
| SIM | 2 * Nano SIM card slots | |||
|
Internal I/O |
USB | 2 * USB2.0 (wafer) | ||
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | |||
| TFront Panel | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | |||
| Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | |||
| Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | |||
| Serial | 2 * RS232 (COM5/6, wafer) | |||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | |||
| LPC | 1 * LPC (wafer) | |||
| SATA | 2 * SATA 7P Connector | |||
| SATA Power | 2 * SATA Power (wafer) | |||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (wafer) |
|||
|
Power Supply |
Type | DC, AT/ATX | ||
| Power Input Voltage | 9 ~ 36VDC, P≤240W | |||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | |||
| RTC Battery | CR2032 Coin Cell | |||
|
OS Support |
Windows | 6/7th Core?: Windows 7/10/11 8/9th Core?: Windows 10/11 |
||
| Linux | Linux | |||
|
Watchdog |
Output | System Reset | ||
| Interval | Programmable via Software from 1 to 255 sec | |||
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | ||
| Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | 268mm(L) * 194.2mm(W) * 159.5mm(H) | |
| Weight | Net: 4.5 kg Total: 6 kg (Include packaging) |
Net: 4.7kg Total: 6.2 kg (Include packaging) |
Net: 4.8 kg Total: 6.3 kg (Include packaging) |
|
| Mounting | VESA, Wall mounted, Desktop | |||
|
Environment |
Heat Dissipation System | PWM Fan Cooling | ||
| Operating Temperature | -20~60℃?(Industrial SSD) | |||
| Storage Temperature | -40~80℃?(Industrial SSD) | |||
| Relative Humidity | 10 to 90% RH (non-condensing) | |||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |||
| Certification | CCC, CE/FCC, RoHS | |||
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嵌入式工控機/BOX E7S系列Q170平臺
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